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Low Capacitance ESD Protection Array
Maximum Rating (at T A =25°C unless otherwise noted)
SMD Diodes Specialist
comchip
Parameter
Peak pulse current ( tp = 8/20 us)
Operating supply voltage
ESD per IEC 61000-4-2(Air)
ESD per IEC 61000-4-2(Contact)
Lead soldering temperature
Operating temperature
Storage temperature
DC voltage at any I/O pin
Symbol
I PP
V DC
V ESD
T SOL
T j
T STG
V IO
Value
6
6
17
12
260 ( 10 sec)
-55 to +85
-55 to +150
(GND -0.5) to (VDD +0.5)
Unit
A
V
kV
°C
°C
°C
V
Electrical Characteristics (at T A =25°C unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Reverse stand-Off voltage
Reverse leakage current
Channel leakage current
Diode breakdown voltage
Pin 4 to Pin 1
V RWM = 5 V, T=25°C, Pin 4 to Pin 1
V PIN 4 = 5 V, V PIN 1 = 0V , T=25°C
I R = 1 mA, , T=25°C, Pin 4 to Pin 1
V RWM
I Leak
I CH-Leak
V BV
6.2
5
2
1
V
uA
uA
V
Forward voltage
Clamping voltage
I F = 15 mA, , T=25°C, Pin 1 to Pin 4
I PP = 5 A, tp=8/20us, T=25°C,
Any Channel Pin to Ground
V F
V CL
0.8
8.1
1
9
V
V
IEC 61000-4-2 +6kV, T=25°C,
ESD Holding Voltage
Contact mode Any channel
V hold
13
V
pin to ground
Channel Input Capacitance
Channel to Channel Input Capacitance
V pin4 = 5V,V pin1 = 0V, V IN =2.5V,
f = 1MHz,Any channel pin to ground
V pin4 = 5V,V pin1 = 0V, V IN =2.5V
f = 1MHz,Between channel pin
C IN
C CROSS
1.2
0.1
1.4
0.12
pF
pF
V pin4 = 5V,V pin1 = 0V, V IN =2.5V
Voltage of Channel Input Capacitance
f = 1MHz,Channel_x pin to ground -
?C IN
0.04
0.06
pF
channel_y pin to ground
REV:H
QW-BP012
Comchip Technology CO., LTD.
Page 2
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